| Title |
Joule Heating Effects and Initial Resistance in Electromigration Test |
| Authors |
주철원(Ju, Cheol-Won) ; 강형곤(Gang, Hyeong-Gon) ; 한병성(Han, Byeong-Seong) |
| Keywords |
초기저항값 Joule heating ; Electromigration ; TCR ; Void |
| Abstract |
Joule heating effect in EM(Electromigration) test were performed on a bend test structure. EM test is done under high current densities(1.0-2.5MA/cm2), which leads to joule heating. Since joule heating is added to the controlled oven(stress) temperature, themetal line temperature is higher than the stress temperature. The increase in the stress temperature due to joule heating is important because EM phenomena and metal line failure are related to the stress temperature. In this paper, metal line was stressed with a current density of 1.0 MA/cm^2, 1.5MA/cm^2, 2.0MA/cm^2, 2.5MA/cm^2, for 1200 sec and temperature increase due to joule heating was less than 10°C. Also it took 30 minutes for the metal line to equalized with oven temperature. Recommendations are given for the EM test to determine the initial resistance of EM test structure under stress temperature and current density. |