| Title |
Fabrication of Copper Electrode Array and Test of Electrochemical Discharge Machining for Micro Machining of Glass |
| Keywords |
ECDM ; Copper Electrode ; Glass Machining ; Borofloat33 |
| Abstract |
In this paper, we present the fabrication of copper electrode array and test of electrochemical discharge machining(ECDM) for glass machining. An array of 72 Cu electrodes is used to machine Borofloat33 glass. The height and diameter of a Cu electrode are 400 μ textrm m and 100 μ textrm m respectively. It is fabricated by ICP-RIE, Au-Au thermo-compression bonding, and copper electroplating. Borofloat33 glass is machined by the fabricated copper electrode array in 60 seconds at 55 V. The surface roughness of the machined glass is measured and the machined glass is anodically bonded with silicon. |