| Title |
Plasma Cleaning Effect for Improvement of Package Delamination |
| Authors |
구경완(Koo Kyung-Wan) ; 김도우(Kim Do-Woo) ; 왕진석(Wang Jin-Suk) |
| Keywords |
Wire Bonding ; Delamination ; Plasma Cleaning ; Bake ; Reflow |
| Abstract |
The effect of plasma cleaning was examined on package delamination phenomena in the integrated circuit (IC) packaging process. Without plasma cleaning, delamination was observed for all three experimental treatments applied after the packaging step, which include bake of If, reflow, and bake of If followed by reflow However, no delamination was observed when the plasma cleaning was performed before and after the wire bonding step. Plasma cleaning was found to be a critical step to improve the reliability of the package by reducing the possibility of contact failure between die pad and bonding wire. |