| Title |
Fast Defect Detection of PCB using Ultrasound Thermography |
| Authors |
조재완(Cho Jai-Wan) ; 서용칠(Seo Yong-Chil) ; 정승호(Jung Seung-Ho) ; 김승호(Kim Seungho) ; 정현규(Jung Hyun-Kyu) |
| Keywords |
Active Thermography ; Ultrasound ; PCB ; Defect Detection ; Infrared Camera |
| Abstract |
Active thermography has been used for several years in the field of remote non-destructive testing. It provides thermal images for remote detection and imaging of damages. Also, it is based on propagation and reflection of thermal waves which are launched from the surface into the inspected component by absorption of modulated radiation. For energy deposition, it use external heat sources (e.g., halogen lamp or convective heating) or internal heat generation (e.g., microwaves, eddy current, or elastic wave). Among the external heat sources, the ultrasound is generally used for energy deposition because of defect selective heating up. The heat source generating a thermal wave is provided by the defect itself due to the attenuation of amplitude modulated ultrasound. A defect causes locally enhanced losses and consequently selective heating up. Therefore amplitude modulation of the injected ultrasonic wave turns a defect into a thermal wave transmitter whose signal is detected at the surface by thermal infrared camera. This way ultrasound thermography(UT) allows for selective defect detection which enhances the probability of defect detection in the presence of complicated intact structures. In this paper the applicability of UT for fast defect detection is described. Examples are presented showing the detection of defects in PCB material. Measurements are performed on various kinds of typical defects in PCB materials (both Cu metal and non-metal epoxy). The obtained thermal image reveals area of defect in row of thick epoxy material and PCB. |