| Title |
TSV Fault Detection Technique using Eye Pattern Measurements Based on a Non-Contact Probing Method |
| Authors |
김영규(Kim, Youngkyu) ; 한상민(Han, Sang-Min) ; 안진호(Ahn, Jin-Ho) |
| DOI |
https://doi.org/10.5370/KIEE.2015.64.4.592 |
| Keywords |
TSV Fault ; 3D-IC ; Non-Contact Test ; Eye Pattern ; Capacitive Coupling |
| Abstract |
3D-IC is a novel semiconductor packaging technique stacking dies to improve the performance as well as the overall size. TSV is ideal for 3D-IC because it is convenient for stacking and excellent in electrical characteristics. However, due to high-density and micro-size of TSVs, they should be tested with a non-invasive manner. Thus, we introduce a TSV test method on test prober without a direct contact in this paper. A capacitive coupling effect between a probe tip and TSV is used to discriminate small TSV faults like voids and pin-holes. Through EM simulation, we can verify the size of eye-patterns with various frequencies is good for TSV test tools and non-contact test will be promising. |